电子器件封装工艺技术新进展

The Progress Of Packaging Technology For Components

该文扼要分析了电子器件封装技术迅速发展的成因,预测了电子封装新技术的发展方向,深入阐述了引脚布置方式的突破,BGA技术的发展,BGA和倒装芯片结合的优势,CSP产业化的关键,在晶圆片上进行CSP封装的新工艺,以及倒装芯片和CSP封装的综合比较。

The artivie briefs the cause of farst develapment of packaging technology for components and forecasts the trend of new packaging technology. In this article, we can know the development of BGA technology, advamtage of the integration between BGA and flip-chip, The author, in the end ,introduces the new CSP packaging process and comprehensive comparison betwen flip-clip and CSP packaging.