焦磷酸盐体系化学镀钴磷合金工艺研究

STUDY ON ELECTROLESS Co-P IN PYROPHOSPHATE SYSTEM

本文介绍了以焦磷酸钠为络合剂,硫酸铵为加速剂的化学镀Co-P合金的工艺条件,并测定了该配方的反应表现和活化能,包括各成分对镀速的影响和作用、温度对镀速的影响、镀层外观及结合力、镀液的稳定性等。该项配方及工艺条件的镀速较快,稳定性亦较好。

Technological conditions of electroless Co-P alloy plating with sodium pyrophosphate as complex and ammonium sulfate as accelerator is stated. Reaction behavior and activating energy of the formulation, including effects of various constituents and temperature on plating rate, appearance and adhesion of the deposit and bath stability, are measured. The formulation and technological conditions are higher in plating rate and more stable for the bath.