摘要
文章给出了三价铬电镀的镀液配方和操作条件;着重研究了电流密度、电镀时间和溶液温度及酸度对镀层厚度的影响;对电镀过程中溶液温度和pH随时间的变化情况做了详细介绍,指出镀层不能增厚的原因是阴极表面附近液层的温度和pH升高所致。
Solution composition and technological conditions for chromium plating with Cr (Ⅲ) bath are given in this paper. Investigations of influences of current density, plating time and temperature and pH value of the plating solution on thickness of the chromium coating obtained are centered. Changes of temperature and pH value of the plating bath with time in the plating process are described in detail. Rising of temperature and pH value of the solution near the cathode surface hinders the coating from thickening continuously.
出处
《电镀与精饰》
CAS
1992年第6期3-6,共4页
Plating & Finishing
关键词
电镀
镀铬
铬膜
增厚
chromium plating with Cr (Ⅲ) bath
thickening