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SEM测量微细工件表面粗糙度的一种方法

The Use of SEM in Micro-Surface Roughness Measurements
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摘要 介绍一种用扫描电子显微镜(SEM)来测量微细工件表面粗糙度的方法,可在微电子元件如TO-5封装的焊线顶上应用.操作时,电子显微镜发出电子束对样品表面进行扫描,而反映表面波纹状况的二次电子强度可用底片摄录;照片上的波纹曲线再用一自制的数码转换器转成数码信号,输入微型计算机处理后可求得粗糙度.用此法求得的结果与传统的表面波纹测量法极为吻合. A method making use of the scanning electron microscope is developed to measure the surface roughness of a microscopic sample such as the top of a connecting post of TO-5 package. The electron beam of the SEM scans along the surface. The intensity of the emitted secondary electrons which reveal the surface profile is recorded on a photographic plate. A home-made digitizer is built and has been found to be a versatile tool. The curve is digitized and the roughness is estimated. The results obtained by this method compare favorably with conventional profilometrie method.
出处 《电镀与涂饰》 CAS CSCD 1992年第1期15-19,共5页 Electroplating & Finishing
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参考文献3

  • 1包学诚,陈雅贞,海啸,赵周.光纤型表面粗糙度比较测量仪的研制[J].仪器仪表学报,1989,10(1):72-77. 被引量:3
  • 2M. Chomakova,S. Vitkova. Microthrowing power of electrolytes for the deposition of nickel-iron alloys. I. Components determining the levelling effect of nickel-iron plating electrolytes[J] 1986,Journal of Applied Electrochemistry(5):669~672
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二级参考文献2

  • 1匿名著者,1985年
  • 2匿名著者,1981年

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