摘要
A new method has been developed for fabrication of copper micro-pattern by selective chemical copper deposition based on photolithographed (3-mercaptopropyl)-trimethoxysilane (MPTS) self-assembly monolayers (SAMs). As confirmed by scanning electron microscopy (SEM), Cu closely replicated the mask features. The present approach makes this technic to be cheap and may be applicable to assembly of microelectronic circuits.
A new method has been developed for fabrication of copper micro-pattern by selective chemical copper deposition based on photolithographed (3-mercaptopropyl)-trimethoxysilane (MPTS) self-assembly monolayers (SAMs). As confirmed by scanning electron microscopy (SEM), Cu closely replicated the mask features. The present approach makes this technic to be cheap and may be applicable to assembly of microelectronic circuits.
基金
This work was supported by the National Natural Science Foundation of the Peoples Republic of China (No. 69890220).
