电化学沉积法制备金(核)-铜(壳)纳米粒子阵列

Preparation of Au(core)-Cu(shell) Nanoparticles Assembly by Electrodeposition

以组装在有机分子自组装膜/金基底电极上的Au纳米粒子阵列为电化学沉积模板,制备了金(核)-铜(壳)纳米粒子阵列.选用巯基十一胺(AUDT)和巯基癸烷(DT)混合自组装膜作为基底电极与Au纳米粒子的耦联层,可以在一定的电位下实现金属Cu在Au纳米粒子上的选择性沉积.将沉积电位控制在-0.03V(vsSCE)时,沉积初期(t≤15s,沉积粒子粒径≤20nm)金(核)-铜(壳)粒子具有良好的单分散性和近似球形,而且粒径实验值同计算值非常吻合.

Submonolayer assembly of Au (core) Cu (shell) nanoparticles was prepared by electrodeposition of Cu on Au nanoparticles assembly electrode,where AUDT+DT mixed monolayer was used as the coupling layer between gold substrate and Au nanoparticles. Under suitable polarized potential,Cu was found to be selectively electrodeposited on Au nanoparticles rather than on the organic monolayer.At -0.03 V,Au (core) Cu (shell) nanoparticles have good monodispersity and spherical shape until their diameters exceeded 20 nm,and the diameters of which are in good accordance with those calculated by coulometry.