浅析贴片设备

Pick-and-place Machine Analysis

由于表面组装技术不断地朝着小型化的方向发展 ,特别是在细间距、小直径的凸点和使用的焊剂等诸多因素的推动下 ,促使设备供应商根据倒装芯片技术的需求而研制新一代的贴装机。介绍了设备的制造厂家根据倒装芯片的特点 ,采用柔性 (软件 )方法和视觉系统等方案对现有的设备进行改型 ,从而实现了贴装设备的自动化。实践证明研制开发倒装芯片技术的自动组装技术可使生产率。

Equipment manufacturers have developed and manufactured a new generation of pick and place machine according to the demands of flip chip technology driven by minimum trends of SMT continuously, especially fine pitch, small diameter of bump and flux type used etc;This paper mainly describes equipment manufacturers have modified the existing equipment with flexible method and vision system scheme according to the characteristics of flip chip to realize the automation of pick and place machine. Practice showed that developing and manufacturing the automatic assembly technology for flip chip can achieve significant progress in productivity, material and process equipment.