摘要
本文主要介绍贴片胶的特性 ,在各种工艺下的使用方法及使用中出现的不良与对策 。
The characteristics and different using requirements in various construction processes for acrylate type and epoxy resin type surface mount adhesives were introduced. Moreover, some harmful tendencies and the way to deal with them in using processes were presented. The future trend of this kind of adhesive was briefly analysed.
出处
《电子工业专用设备》
2002年第4期252-254,共3页
Equipment for Electronic Products Manufacturing
