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甚薄型QFN封装技术 被引量:1

Super thin QFN package technology
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作者 王耘
出处 《今日电子》 2002年第12期53-54,共2页 Electronic Products
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  • 1Fan X J, Zhang G Q, Ernst L J. A micro-mechanics approach for polymeric material failures in microelectronic packaging [A]. In: 3rd International Conference on Thermal and Thermo-Mechanical Simulation in Microelectronics, ESIME 2 [C]. Paris: The Conference Organizer, 2002. 5-15.
  • 2Wong E H, Rajoo R, Koh S W, et al. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging [J]. J Electron Packg, 2002, 124(16): 122-126.
  • 3Pearson R A. Adhesion issues in epoxy-based chip attach adhesives[J].IEEE Trans Compon, Packg, Manuf Technol, Part A, 1997, 20(1): 31- 37.
  • 4Wong E H, Chan K C, Rajoo R, et al. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging [A]. The 50th Electronic Components and Technology Conference [C]. Piscataway, NJ, USA: IEEE, 2000. 576-580.
  • 5邹祖讳 吴人洁.复合材料的结构与性能[M].北京:科学出版社,1999..

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