摘要
乙二胺四乙酸(EDTA)是一种强络合剂,在化学镀铜工艺中广泛使用,并导致镀铜废水中含有一定量的EDTA。氨基磷酸树脂(APAR)吸附法被广泛应用于含铜工业废水治理。为优化该方法,研究不同EDTA/Cu(摩尔比)、pH、钠离子、钙离子浓度下EDTA对APAR去除铜离子性能的影响。溶液中EDTA浓度增加导致APAR去除Cu(Ⅱ)能力下降;pH=5时,EDTA对APAR除Cu(Ⅱ)性能的影响较小;EDTA对树脂除铜性能的削弱不受溶液中离子强度变化或Ca2+存在的影响。红外光谱分析表明,有一部分EDTA-Cu络合物被吸附到树脂内部。
Ethylene diaminetetraaceticacid( EDTA) is a strong complexing agent and widely used in the electroless copper plating. Because of EDTA's complexation with Cu( Ⅱ),it is difficult to remove Cu( Ⅱ) from the effluent of electroless copper plating. Aminophosphonic acid resin( APAR) is widely applied in the industrial wastewater treatment because of the high performance on heavy metal ions adsorption. To understand the effect of EDTA on APAR removal of Cu( Ⅱ),the impacts of different EDTA /Cu( molar ratio),solution pH,Na+and Ca2+ concentration on the Cu( Ⅱ) adsorption by APAR were examined. Results show that higher EDTA concentration leads to less adsorption of Cu( Ⅱ),while the impact would be relatively weaker when pH is around 5. Besides,ion strength and coexisting Ca2+ have little effect on the decrease of Cu( Ⅱ) removal efficiency caused by EDTA. FTIR study shows that partial EDTA-Cu complex is adsorbed to the internal of APAR.
出处
《环境工程学报》
CAS
CSCD
北大核心
2014年第7期2913-2917,共5页
Chinese Journal of Environmental Engineering
基金
江苏省自然科学基金重点专项(BK2011016)
关键词
氨基磷酸树脂
乙二胺四乙酸
除铜
尾水处理
aminophosphonic acid resin
ethylene diaminetetraaceticacid
Cu(Ⅱ) removal
effluent treatment