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表面组装件的失效机理及可靠性评价 被引量:1

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作者 韩常英
出处 《电子产品可靠性与环境试验》 1992年第3期2-6,共5页 Electronic Product Reliability and Environmental Testing
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  • 1SATCHIDANANDA M, SATCHIDANANDA G, PECHT M, et al. Life consumption monitoring for electronics prognostics[C]//Proceedings of the IEEE Aerospace Conference. Big Sky, Montana, USA. 2004:3 455-3 467.
  • 2RAMAKR/SHNAN A, PECHT M, A life consumption monitoring methodology for electronic systems[J]. IEEE Transactions on Components and Packaging Technologies, 2003, 26(3): 625-634.
  • 3[日]盐见弘.失效物理基础[M].杨家坚,关成勋,译.北京:科学出版社,1982.
  • 4Deliverable report 16 of the environmental life cycle information management and acquisition for consumer products[R]. Project Funded By the European Community under the Competitive and Sustainable Growth Program, 2005.
  • 5MISHRA S, PECHT M, SMITH T, et al. Life consumption monitoring approach for remianing life estimation[C]//European Microeletronics Packaging and Interconnection Symposium. Cracow, Poland. 2002. 136-142.
  • 6倪侃.随机疲劳累积损伤理论研究进展[J].力学进展,1999,29(1):43-65. 被引量:65

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