无铅焊膏在电子封装组装中的应用

Lead-Free Solder Paste Applied in Surface Mount Technology

随着人们对环境的日益重视和电子封装组装焊接技术的发展 ,合金焊膏的无铅化和质量的要求越来越高。开发无铅、无毒焊膏成为焊膏开发的重要方向。本文论述了几种无铅焊膏Sn -Ag系 ,Sn -Bi系和Sn -Zn系的特点。同时 ,也检测和评价了一种Sn -Ag免洗焊膏 ,其绝缘抗阻性、抗腐蚀性、产品清洁度和产品可靠性等均符合要求。

The conventional tin-lead solder can't meet the demand of SMT(Suface Mount Technology) development and prohibiting surrounding pollution,anymore.In this paper,we discussed the development and the using of lead-free solder paste,which covered Sn-Ag Sn-Bi,Sn-Zn,and so on.Meanwhile,we evaluated a kind of no-clean lead-free solder paste,Sn 96.5-Ag 3.5.Its insurance and corrosion inhibition of flux are good After it was used in SMT,the electronic products connected by no-clean solder paste are clear,they are not need to clean after soldered.And their reliability is excellent