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Al-Cu合金等温凝固的相场法模拟 被引量:6

Numerical Simulation of Al-Cu Alloy Isothermal Dendritic Growth by Phase-field Model
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摘要 采用相场与浓度场耦合的相场法对Al-Cu二元合金等温凝固中的枝晶长大过程进行了二维数值模拟。在模拟中,研究了搅动及不同的过冷度对枝晶生长形貌的影响,并对相场和浓度场作了对比和分析。在数值计算过程中,利用薄的界面限制条件获得了相关的相场参数,计算采用均匀网格一般显式有限差分法。计算结果显示出与实践经验相一致的各种凝固特征。 The phase-field model which coupled the concentration field and phase field is applied to simulate microstructural evolution during isothermal dendritic growth of Al-Cu binary in 2-D. In simulation, studied the noise and different surperfluous temperature how to affect the growth of dendritic and compared phase-field figure with concentration field figure. The parameters of phase-field equation are determined by a thin interface limit condition. The phase-field model equations have been solved using the explicit finite difference method on an uniform mesh. The calculated results show various solidification features consistent with our experience.
机构地区 沈阳工业学院
出处 《铸造设备研究》 2002年第6期15-18,22,共5页 Research Studies On Foundry Equipment
关键词 AL-CU合金 等温凝固 相场法 数值模拟 alloy isothermal solidification phase-field method
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二级参考文献3

  • 1Tong X,Modeling of Casting,Welding and Advanced Solidification Processes VIII,The Miner,1998年,613页
  • 2Wang S L,Phys,1993年,69D期,189页
  • 3Zhu P P,Acta Metall Mater,1992年,40卷,3369页

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