摘要
本文详细介绍了当前各种高频微波电路的封装模型,以及分析这些模型的场分析方法和分布网络分析方法。为了减少微波封装电路的插入和反射损耗,各种改进的加工技术被引入。
The package models for microwave integrated circuits of high frequency, as well as the field analysis and the distributed net analysis for them, are introduced in detail in the paper. Some improved processing technologies to decrease the inserting and reflecting loss are also discussed.
出处
《微电子技术》
2002年第6期30-33,共4页
Microelectronic Technology
