摘要
介绍了氰酸酯树脂(CE)的发展史、合成方法、性能、改性体系及其在微电子工业的应用,展望了CE的发展方向。CE是近年来发展起来的一种新型工程塑料,具有极低的介质损耗角正切值、优异的耐湿热性能和力学强度,是一种有广泛应用前景和强劲市场竞争力的材料。
The history, synthesis, properties, modification and application in the microelectronic- industry of cyanate resin are introduced. The development tendency of cyanate resin is also discussed. Cyanate resin is a newly developing engineering plastics with excellent hot/wet service temperature, dielectric and mechanical performance. It has widely applied perspective and will be very competitive in market with other engineering plastics.
出处
《工程塑料应用》
CAS
CSCD
北大核心
2002年第12期34-36,共3页
Engineering Plastics Application
基金
北京市科技新星计划资助项目(9558101200)
