未来微处理器的封装技术——新型无凸点叠层封装

Packaging Technology for Future Microprocessor ——Novel Bumpless Build-up Layer Packaging

无凸点叠层(BBUL)封装技术是Intel公司研制出的1种新型封装技术,用以满足未来微处理器封装技术的要求。这种BBUL封装技术具有巨大的优越性,它免除了大多数高性能的倒装芯片所用的大量焊料凸点和互连,使环路电感量小、热机械应力小,不但减小芯片连接的寄生效应,而且提高了微处理器芯片的效率。此外,该封装的体积比传统封装更小、更轻,使多芯片之间的互连更为紧密。特别适合于高引出端的电子类及光电子产品,如逻辑单元、存储器、射频器件以及微型机电一体化系统。本文主要从其发展背景、工艺及特性方面阐述这种新型BBUL封装技术,最后提出一些建议。

BBUL (Bumpless Build-up Layer) packaging is a novel package technology developed by lntel to meet future microprocessor packaging technology requirement. BBUL packaging offers a number of advantages over the conventional package, it eliminates lots of solder bumps and interconnects in the most of high performance flip-chip. And the BBUL package reduced the electrical loop inductance and thermomechanieal stresses. This approach not only reduces the parasites of die connection, but also raise the efficiency of microprocessor chip. Furthermore, it allows for high lead count, ready integration of multiple electronic and optical components such as logic, memory, radio frequency, microelectromechanical systems(MEMS) and so on. This paper describes the background, the process and, electrical attributes of BBUL.