摘要
由于集成电路的硅芯片与其周围的塑料封装材料热膨胀系数的不协调,产生的热残余力会直接导致封装结构的破坏及集成电路的失效· 将硅芯片的角点结构模化成半无限大楔体,求得了热应力分布的解析解· 在此基础上。
Due to the mismatch in the coefficients of thermal expansion of slicon chip and the surrounding plastic encapsulation materials,the induced thermal stress is the main cause for die and encapsulant rupture.The corner geometry is simplified as the semi_infinite wedge.Then the two_dimensional thermal stress distribution around the corner was obtained explicitly.Based on the stress calculation,the strain energy density factor criterion is used to evaluate the strength of the structure,which can not only give the critical condition for the stresses,but also determine the direction of fracture initiation around the corner.
出处
《应用数学和力学》
EI
CSCD
北大核心
2003年第2期138-145,共8页
Applied Mathematics and Mechanics
关键词
塑料封装集成电路结构
热应力
解析解
elcetronic package structure
thermal stress
analytical solution
