摘要
从混合导体LTCC基板的微观结构,导体的附着力,导体键合强度,多层互连导带电阻以及基板绝缘电阻等方面,对混合导体LTCC基板的可靠性进行了分析研究。结果表明:基板内部的银导体不存在迁移现象,导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。
The reliability of mixed conductor LTCC substrates was analyzed, in respects of the microstructure, conductor adhesive force, wire-bonding strength, insulation resistance, etc. The results show that there is not any evidence of silver migration within LTCC construction, and conductor adhesive force, wire-bonding strength and insulation resistance are high.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2003年第2期7-9,共3页
Electronic Components And Materials
