摘要
介绍了铝碳化硅复合材料T/R组件封装外壳的研制。用磷酸铝溶液、聚乙二醇、蒸馏水、糊精和淀粉配制碳化硅浆料的粘结剂,采用双向模压法制备带金属镶嵌件的近净成型的碳化硅预制件。碳化硅预制件经压力浸渗后得铝碳化硅复合材料构件坯料。构件坯料用金刚石砂轮和电火花进行少量机械加工,并进行化学镀镍后得到铝碳化硅复合材料T/R组件封装外壳。
The development of the housing made form aluminum silicon carbide for T/R modules is presented. The binder used was mixed with acid phosphate aluminum, polyethylene glycol, distilled water, dextrin and starch. The near-net-shaped silicon carbide preformed units with metallic inserts were processed by two-direction pressing. AlSiC composites were fabricated by pressure-infiltrating porous silicon carbide particle preformed units. The housing of AlSiC composites were acquired after grinding with diamond wheels, electro-discharge machining, and electroless-nickel-deposit.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2003年第2期17-19,共3页
Electronic Components And Materials
关键词
封装
铝碳化硅复合材料
预制件
T/R组件
压力浸渗
aluminum silicon carbide composites
preformed units
T/R modules
pressure infiltration