全板电镀电流密度分布的研究

Investigation of the Current Density Distribution of Full Plate Electroplating

介绍在印刷电路板全板电镀生产线上,对两种长宽比不同的电路板进行电镀试验;用取点切片显微分析的方法,研究电流密度的分布情况。分析影响板面镀层厚度均匀的因素,达到提高产品质量。

We would like to test two types of the printed circuit board with different ratio of length and width, such kind of the printed circuit board are usually found in the full plate electroplating production lines. We shall use the microscopic analysis technique to investigate the current density distribution. For analyzing the thickness of the electroplating layer, the product qualities would be increased.