摘要
金属铜粉由于它具有固有的光泽、良好的导电性和低廉的价格,作为导电涂料的填料引起了人们的关注。但铜较活泼,容易被氧化。在贮存和运用过程中,铜粉表面容易形成Cu2O和CuO不导电薄膜,这给铜粉的使用带来了障碍。在铜粉表面包覆硬脂酸是防止铜粉氧化而实施的一种方法,但硬脂酸是一种不导电的有机物,这给制备导电涂料带来了不便。针对以上两种情况,本文探讨了对表面部分氧化的铜粉和包覆有硬脂酸的铜粉的处理方法,以及它们对涂料导电性的影响。
Copper powder as filler of conductive coating is much accounted of its intrinsic luster, good conductive property and low price. But copper is an active metal and easily oxidized. Cu2O and CuO nonconductive films form easily on the surface of copper powder. It brings some obstacles to use copper powder. A method of preventing oxidation is enveloping stearic acid on copper powder surface. But stearic acid is a nonconductive organic compound. It brings some inconvenience for making conductive film. For the two things, treating methods of partly oxidized copper powder and enveloped stearic acid copper powder on the surface, and their effect on electrical conductivity of coating are discussed in the article.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2003年第1期49-50,54,共3页
Surface Technology
基金
国防科技预研项目(41305060201)
关键词
导电填料
氧化膜
硬脂酸
环氧树脂
偶联剂
Conductive filler
Oxidation film
Stearic acid
Epoxy resin
Couplant