摘要
前文中我们报道了利用铜物理显影的多级放大成像过程能够明显地提高影像密度,从而大大提高了感光材料的感光度或者大幅度地降低感光材料的用银量,并且可以达到特高反差和特短趾部等特殊效果。本文介绍铜物理显影多级放大成像过程的另一种应用:在乳剂层表面或绝缘材料表面上定域沉积能导电的铜影像。
Two new techniques of area-selective metal deposition on dieletric surface by means of copper physical development were developed. One of them is to make the area with normal silver image electrically conductive, and the other is to make the area without silver image electrically conductive. The techniques can be used in the manufacture of printed circuit board, lithographic printing plates, broad parallel cables and bright copper mirror on dielectrics. Some factors that influence copper physical development were discussed.
出处
《感光科学与光化学》
CSCD
1992年第4期368-370,共3页
Photographic Science and Photochemistry
基金
国家自然科学基金
关键词
显影
放大
导电
感光材料
copper physical development, imaging process, area-selective metal deposition, electrically conductive copper image