摘要
用红外光谱和X射线光电子能谱研究了咪唑与金属铜的反应,证明反应生成了咪唑铜盐聚合物,此聚合物能在铜表面形成极薄的保护层,并能引发环氧树脂开环聚合固化,用DSC对咪唑铜盐聚合物引发苯基缩水甘油醚的动力学进行了初步研究,同时测定了界面复合的剪切强度。
The chemical reactions of imidazole with metallic copper was studied by means of IR and XPS. The product is bisimidazolato copper, which covers the surface in the form of a polymeric film. The kinetics of the curing of epoxy resin with bis-imidazolato copper was investigated by DSC. The measurements of tensile shearing strength show that the adherence of copper or iron treated with azoles to epoxy resin is higher than the untreated ones.
出处
《高等学校化学学报》
SCIE
EI
CAS
CSCD
北大核心
1992年第4期546-549,共4页
Chemical Journal of Chinese Universities
基金
高等院校博士点基金
关键词
咪唑/铜
环氧树脂
界面复合
Imidazole/copper, Epoxy resin, Interface composites