波导腔体用微波开关二极管封焊工艺的改进

Improvement on Packaging Process of High Speed Switching Diodes Applied to Wave-guide

从器件的芯片结构及封焊工艺入手,分析了封焊工艺影响成品率的各种原因,并采取相应的改进 措施,提高了器件的成品率。

Various factors affecting the yield of packaging process of high speed switching diodes were analyzed on die structure and packaging process of devices, and steps have been taken to improve the yield of the dioldes.