一类温敏半导体方程的数值分析

The Numerical Analysis for a kind of The Semiconductor Equations with Heat Sensitive

在考虑热效应对器件影响下半导体器件中载流子运动的数学模型,这是一个抛物—椭圆耦合的非线性偏微分方程组的混合初边值问题,在文献4、5的基础上,利用Galerkin有限元法给出了此问题的数值解及误差估计。

This paper considers the mixed IBVP of a parabolic-elliptic coupled system arising in the carrier transport in semiconductor devices with heat sensitive, and the numerical solution and error estimate to the problem are given by Galerkin's methods.