荧光成像技术探测熔石英元件亚表面缺陷

Subsurface Defects in Fused Silica Elements Detected by Fluorescence Imaging Technology

提出荧光成像技术用于无损探测熔石英光学元件亚表面缺陷,利用该方法获得不同加工工艺下熔石英光学元件的亚表面缺陷。结合熔石英光学元件损伤性能研究,分析了熔石英光学元件亚表面缺陷与其损伤性能的关联关系。结果表明,熔石英光学元件损伤阈值与荧光缺陷密度呈反比关系,即亚表面荧光缺陷较少的样品损伤性能较好。这说明利用该技术方法可以有效评价熔石英光学元件的损伤性能。该研究结果对光学元件加工技术具有指导意义。

The fluorescence imaging technology is proposed for non-destructive detection of subsurface defects of fused silica optical elements.The subsurface defects of fused silica optical elements under different processing techniques are obtained by this method.Based on the damage properties of fused silica optical elements,the relationship between subsurface defects and damage properties of fused silica optical elements is analyzed.The results show that the damage threshold of fused silica optical elements is inversely proportional to the density of fluorescent defects,that is the samples with less subsurface fluorescence defects have high damage threshold.This shows that the technique can effectively evaluate the damage performance of fused silica optical elements.The results of this study have guiding significance for optical element processing technology.