基于选择性激光烧结的石墨骨架电镀铜工艺实验研究

Copper Plating of Graphite Skeletons Based on Selective Laser Sintering

为改善结合界面的状况,缩短工艺流程,降低铜的消耗,减少生产投入,采用选择性激光烧结成型技术快速制备多孔石墨成型件。在此基础上,研究了不同石墨预制体状态、电镀工艺参数和电镀时间对镀层的沉积速率、表观形貌以及镀层与基体结合状况的影响。结果表明:未经真空压力浸渍酚醛树脂的石墨预制体,其镀层与基体的结合力不符合应用要求,在真空压力下浸渍酚醛树脂2～3次后,镀层沉积速率较佳,镀层与基体的结合力符合应用要求;电镀时间为30～50min时,沉积速率较佳,可得到表面覆盖完整、连续且有光泽的镀层;电流密度为5×102～6.25×10~2 A·m^(-2)时,镀层晶粒均匀致密,可得到较佳的镀层。

To improve the interface,shorten the process,and reduce copper consumption as well as production input,we use selective laser sintering technology to rapidly prepare molded parts of porous graphite.The effects of graphite preformation states,electroplating process parameters,and plating time on the deposition rate,the apparent morphology and bonding conditions of the plating and substrate are studied.The results reveal that for the preformed graphite that is not impregnated with phenolic resin,the bonding strength between the plating and the substrate does not meet the application requirements.After the preformed graphite is immersed in phenolic resin for 2-3 times under a vacuum pressure,the plating deposition rate is best,and the bonding force between the plating and the substrate meets the application requirements.When the electroplating time is 30 min to 50 min,the deposition rate is best,and a complete,continuous,and glossy plating on the surface can be obtained.When the current density is 5×102-6.25×102 A·m-2,the plated grains are uniform and dense,and a better plating can be obtained.