热稳定聚酰亚胺(PI)LB膜的研究

Characterization of Heat Stable Polyimide LB Film

用优良的绝缘材料聚酰亚胺制得了稳定的 LB 膜,介电和 C-V 特性测量表明它具有良好的绝缘性能,热稳定温度高达340℃以上,远远高于传统的长链脂肪酸,缺陷密度也远低于传统的二氧化硅膜,这使它有可能被应用于微电子工业之中。

We have succeeded in making a new type of LB film-polyimide(PI)film,which showed special advantages in electronics and heat stable character compared with con,ntionl methods.It has a good insulating property and low defect density,and could maintain good C-V character until 340℃.which make it promising to apply PI LB film in microelec- tronics industry.