深径比65:1的激光钻孔

Laser drilling with a depth to diameter ratio of 65:1

本文对激光深微孔加工工艺作了一定的阐述。介绍了深径比为65:1的加工方法。足够的功率密度、用适当的焦距并确定最好象面、再聚焦方法等是激光深微孔加工的重要因素。

This paper describes the technology of laser depth-microdrilling and the processing methods with a depth to diameter ratio of 65:1. The important factors for laser depth-microdrilling are the sufficient power density, suitable focal length, determination of the best image plane and refocusing etc.