摘要
采用金刚石与W粉混合制备预制坯,然后通过无压浸渗制备金刚石/铜复合材料。采用SEM、XRD、激光热导仪等手段,分析了不同的掺杂量对金刚石/铜复合材料的组织、界面结构及热导率的影响。结果表明,随着W的加入,金刚石与铜的界面结合良好,复合材料的组织更加致密,W元素在界面处富集生成WC、W2C等碳化物。随着掺杂量的增加,复合材料的热导率先升高后下降,最高达到450 W·m^(-1)·K^(-1)。
The diamond and tungsten were firstly mixed and compacted into preforms,and then the preforms were infiltrated by liquid copper without pressure to form the W-diamond / copper composites. The effect of tungsten on microstructure,interface and thermal conductivity of the composites was analyzed by means of SEM,XRD and laser flash thermophysical properties analyzer. The results show that with increase of doping content of tungsten,the interfaces between diamond and copper bond better,and the microstructure is more compact. The tungsten is enriched in the surface of diamond and generates WC、W2C and other carbides. With the increasing of doping content,the thermal conductivity of the composites increases at first and decreases later. The maximum value is about 450 W·m^(- 1)·K^(- 1).
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2015年第S2期18-22,共5页
Transactions of Materials and Heat Treatment
基金
国家自然科学基金(51264033)
江西省自然科学基金(20132BA206019
20151BAB206012)
南昌市社科规划项目(JJ201334)
关键词
金刚石/铜
无压浸渗
组织
热导率
diamond/Cu
pressureless infiltration
microstructure
thermal conductivity
