摘要
总结和分析了激光热应力控制断裂切割技术(激光热裂切割技术)的基本原理、技术特点以及优缺点。针对激光热裂切割技术存在的问题,详细阐述了近20年来发展起来的以热应力控制断裂为基本原理的激光切割改进技术,包括辅助激光热裂切割技术(水冷、预弯曲辅助等)、双激光束热裂切割技术、激光隐形切割技术、激光多焦点热裂切割技术、超短脉冲激光热裂切割技术、基于热应力法微波切割技术和适用于非对称切割材料(包括非对称直线切割、折线切割、曲线切割等)的激光切割路线偏离矫正技术。通过对比和分析各类切割技术的优缺点,希望为激光热裂控制切割脆性材料技术的进一步探索和研究提出可行性思路。最后,在此基础上对激光热裂切割脆性材料存在的问题和发展前景进行总结并提出相关建议。
The basic principle, technical features, and relative merits of laser cutting technology with thermal-induced crack propagation(named as LCT-TCP) are summarized and analyzed. In view of the problems existing in the LCT-TCP, the improvement technology for laser cutting based on thermal-induced crack propagation developed in the past 20 years is described in detail, including auxiliary LCT-TCP(water cooling, pre-bending auxiliary, etc.), double LCT-TCP, laser stealth cutting technology, multi-focus LCT-TCP, ultrashort pulse LCT-TCP, thermal stress based microwave cutting technology and laser cutting technology with path compensation suitable for asymmetric cutting materials(including asymmetric linear cutting, fold line laser cutting, curve cutting, etc.). By comparing and analyzing the advantages and disadvantages of various cutting technologies, it is expected that a feasible idea for the further exploration and research of LCT-TCP for brittle materials is proposed. Finally, the problems and development prospects of the LCT-TCP for brittle materials are summarized and some suggestions are put forward.
作者
孙传松
程相孟
代祥俊
王延遐
周继磊
SUN Chuan-song;CHENG Xiang-meng;DAI Xiang-jun;WANG Yan-xia;ZHOU Ji-lei(Shandong Provincial Colleges and Universities Key Laboratory of Analysis of Structure and Dynamics,School of Transportation and Vehicle Engineering,Shandong University of Technology,Zibo 255049,China;Advanced Manufacturing Research Institute,School of Mechanical Engineering,Shandong University of Technology,Zibo 255049,China)
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2019年第1期9-22,共14页
Transactions of Materials and Heat Treatment
基金
国家自然科学基金(11672167
11702161)
关键词
激光
热应力
激光热裂切割技术
脆性材料
laser
thermal stress
laser cutting technology with thermal-induced crack propagation
brittle materials