石墨烯增强铜基复合材料的制备及其微观组织与性能研究

Preparation,microstructure and properties of graphene reinforced copper matrix composite materials

利用分子级混合法在不同溶液水热温度(40、60、80、100℃)下制备还原氧化石墨烯(RGO)/铜纳米复合材料。通过原子力显微镜(AFM)、扫描电镜(SEM)、拉曼(Raman)光谱、X射线衍射仪(XRD)对不同溶液反应温度下制备的复合材料粉末进行微观组织分析,并对烧结后样品进行导电导热及力学性能研究以确定制备RGO/Cu纳米复合材料相对合适的溶液反应温度。结果表明,当溶液反应温度为80℃时,铜镀层能够连续致密覆盖在RGO表面,有效阻止其团聚并获得良好的界面结合。制备出1.0%(体积分数)RGO含量的复合材料的硬度比纯铜提高了90%,抗拉强度比纯铜提升了28.8%,导电导热性能也达到最佳值(热导率350W·m-1·K-1,电导率达89%IACS)。过高的溶液反应温度不利于复合材料获得良好的物理力学性能。

Reduced graphene oxide(RGO)/copper nanocomposite specimens were prepared by molecular-level mixing process in different solution temperatures(40,60,80,100℃).The microstructure of the nanocomposite powders under different preparation conditions were analyzed by atomic force microscopy(AFM),scanning electron microscopy(SEM),Raman spectroscopy and X-ray diffractometer(XRD).The nanocomposite specimens were investigated for electrical and thermal conductivity and mechanical properties to determine the relatively suitable preparation solution temperatures of RGO/Cu nanocomposites.The results showed that when the solution temperature reached 80℃,the copper coating could cover the surface of RGO uniformly and densely,effectively preventing its agglomeration and obtaining good interfacial bonding,thus obtaining relatively good physical and mechanical properties.The hardness of the composite prepared with 1.0 vol%RGO was 90%higher than that of pure copper,and the tensile strength was 28.8%higher than that of pure copper,the electrical and thermal conductivity also reached the optimal value(the thermal conductivity was 350 W·m-1·K-1,and the electrical conductivity reached 89%IACS).Excessive solution reaction temperature was not conducive to obtain the best physical and mechanical properties.