Al_2O_3/Kovar热等静压扩散层的组织与性能

Microstructure and mechanical properties of HIP diffusion bonded Al_2O_3/Kovar joint

采用Ti-Ni及Ag-Cu-Ti为过渡层材料实现了Al2O3陶瓷与Kovar合金的热等静压扩散连接。利用金相显微镜、SEM、EDS和万能试验机等测试分析了Al2O3/Kovar扩散接头的显微组织、界面反应及剪切强度。结果表明,Al2O3/Ti-Ni/Kovar接头连接界面处无孔洞等显微缺陷,但其强度及气密性较低,剪切强度及漏率分别为67 MPa及约2.0×10-10Pa·m3/s;Al2O3/Ag-Cu-Ti/Kovar接头之间界面连接良好,无明显显微缺陷,接头强度及气密性较高,剪切强度及漏率分别为85 MPa及<0.5×10-10Pa·m3/s。

Al2O3ceramic and Kovar alloy were bonded by hot isostatic pressing( HIP) diffusion with filler metal of Ti-Ni and Ag-Cu-Ti,respectively. Microstructure,interfacial reaction and shear strength of the Al2O3/Kovar joints were tested and analyzed by optical microscope,scanning electronic microscope( SEM),energy dispersive spectrometer( EDS) and universal testing machine. The results show that no obvious cracks were observed in both of the Al2O3/Ti-Ni /Kovar interface and Al2O3/Ag-Cu-Ti /Kovar interface,however the shear strength and leakage rate of the Al2O3/Ag-Cu-Ti /Kovar joint are 85 MPa and less than 0. 5 × 10- 10Pa·m3/s,respectively,both are better than those of the Al2O3/Ti-Ni /Kovar joint which shear strength is 67 MPa and leakage rate is about 2. 0 × 10- 10Pa·m3/s.