基于热传导的交流调速控制器功率板布局设计

Power Board Layout Design of AC Controller Based on Heat Conduction

为解决我军仓库使用的24V/250A交流调速控制器功率板合理散热问题,基于热量传导设计一种功率电路板,根据热传导基本理论,选定功率器件型号并进行发热功率逆向验证。选用铝基敷铜板,设定布板规则,对选择功率器件进行电路布板,建立Flo THERM模型仿真,验证布局设计的合理性。

To solve heat dissipation problem of 24 V/250 A AC controller power board in our army,the paper designs a power circuit board. It firstly selects the device type and verifies the heating power according to basic theory of heat conduction.Then,it selects aluminum-substrate copper plate and sets layout rules,and designs the circuit of the selected power devices. Finally,it establishes Flo THERM simulation model to verify the reasonability of the layout design.