摘要
本文介绍了亚微米ULSI工艺中 ,采用钨插塞 (TungstenPlug)制作接触孔与通孔的技术 ,对于WCVD、WEtchback及其常见工艺问题作了一些分析 ,此项技术已经用于C 0 5电路的工艺流片。
The technology of tubgsten plug to make contacts and via holes in sub-micron processing of ULSI is introduced in the paper. Analysis has been developed for WCVD; Wetch-back; and some problems usually found in processing. The technology has been used in IC production of C05.
出处
《微电子技术》
2003年第1期13-15,共3页
Microelectronic Technology
