摘要
单晶硅加工过程中追求切削效率与表面质量既可以提高晶圆自身品质又可以降低生产成本。通过响应曲面法(RSM)建立关于输入参数电压、脉宽、脉间、线锯速度与工艺结果的二阶模型,方差分析表明模型方程可行性。运用改进非支配遗传算法(NSGA-II)对加工工艺进行优化可以得到一组关于工艺结果的非支配解,这些非支配解可以满足不同条件下工程加工者的需要。进行相应实验验证非支配解可行。
Pursuiting cutting efficiency and surface quality during machining monocrystalline silicon can improve the quality of the wafer itself and reduce the production cost. The second-order model of variable parameter voltage,pulse on time,pulse interval,wire saw speed and process result is established by response surface method,The variance analysis shows that the model equation is significant. The improved non-dominated genetic algorithm( NSGA-II) is used to optimize processing process,and we can get a set of non-dominated solutions. These non-dominated solutions can satisfy the needs of engineering workers under different conditions. The corresponding experimental proving the non-dominated solution is feasible.
作者
陈玉龙
李淑娟
卜文浩
王馨翊
CHEN YuLong;LI ShuJuan;BU WenHao;WANG XinYi(School of Mechanical and Precision Instrument Engineering,Xi’an University of Technology,Xi’an 710048,China)
出处
《机械强度》
CAS
CSCD
北大核心
2019年第1期98-103,共6页
Journal of Mechanical Strength
基金
国家自然科学基金项目(51575442)资助~~
关键词
电火花线切割
单晶硅
响应曲面法
NSGA-Ⅱ
Wire electrical discharge machining
Monocrystalline silicon
Response surface method
NSGA Ⅱ
