硬脆单晶材料塑性域去除机理研究进展

Research Progress of Ductile Removal Mechanism for Hard-brittle Single Crystal Materials

硬脆单晶材料具有高硬度、低密度、低热膨胀系数、化学稳定性好等特点,近年来在光学、航空航天、电子、固体激光器等领域应用广泛。这类材料由于高硬度、低断裂韧性等特点,加工过程容易产生脆性断裂,属于典型的难加工材料。硬脆单晶材料的塑性域加工技术成为超精密加工领域研究的热点问题,然而目前对硬脆单晶材料塑性域去除机理的研究尚处于探索阶段。介绍了硬脆单晶材料塑性域加工的概念,综述了硬脆单晶材料的塑性域去除机理,指出了目前硬脆单晶材料在塑性域去除机理研究方面存在的问题,并对硬脆单晶材料塑性域去除机理的未来研究方向进行了展望。

In recent years,hard-brittle single crystal materials are wildly used in optics,aerospace,electronics,solid-state laser and other fields due to their high hardness,low density,low thermal expansion coefficient,chemical stability and other characteristics.However,these materials are typical difficult-to-machine materials and brittle-fracture is easily induced in machining process due to their high hardness and low fracture toughness.The ductile-regime machining of hard-brittle single crystal materials has become a hot researching topic in the field of ultra-precision machining.However,the research on ductile removal mechanism of these materials is still in the exploratory stage.The concept of ductile removal for hard-brittle single crystal materials is introduced,the research progress of the ductile removal mechanism for hard-brittle single crystal materials is summarized,the existing problems in the research of ductile removal mechanism of hard-brittle single crystal materials is pointed out,and the future research direction of the ductile removal mechanism for hard-brittle single crystal materials is prospected.