6Schaper C, El-- Awady K, Kailath T, et al. Charac- terizing Photolithographic Linewidth Sensitivity to Process Temperature Variations for Advanced Re- sists Using a Thermal Array[J]. Applied Physics A: Materials Science ~ Processing, 2005,80 (4) : 899-902.
7Smith M, Mack C, Petersen J. Modeling the Impact of Thermal History during Post Exposure Bake on the Lithographic Performance of Chemically Am- plified Resists[C]//Proc. SPIE 4345. Santa Clara, 2011.
8Wu C, Hamada M, Wu C. Experiments: Planning, Analysis,and Parameter Design Optimization[M]. New York : Wiley-- Interscience, 2000.
9Cain J P, Naulleau P,Spanos C J. Critical Dimension Sensitivity to Post- exposure Bake Temperature Variation in EUV Photoresists [C]//Proc. SHE 5757. San Jose,2005.
10Zhang Q, Friedberg P, Poolla K, et al. Enhanced Spatial PEB Uniformity through a Novel Bake Plate Design[C]//Proc. AEC/APC XVII Symp. Aus- tin, Tx .. AEC/APC, 2005 : 1-5.