摘要
以聚酰亚胺膜作为柔性衬底材料 ,用等离子体增强化学气相沉积 (PECVD)技术制备氢化非晶硅薄膜 .喇曼(Raman)光谱分析表明适当温度下的退火工艺使氢化非晶硅薄膜具有均匀的微硅晶体结构和良好的表面质量 .在扫描电子显微镜下进行的力学性能实验研究表明 ,由于非晶硅薄膜和聚酰亚胺膜之间较强的相互作用 ,使非晶硅薄膜具有优异的柔韧力学性能 ,可以在 5mm以上的曲率半径下保持良好的弹性变形能力 ,在受拉伸情况下可以达到 1 7%的弹性形变范围 ,抗拉伸强度达到 1 45GPa ,完全能够贴附于一般规则和不规则曲面并承受较大的应力作用 .
A route is developed to fabricate novel flexible amorphous hydrogenated silicon films (a-Si∶H films) on polyimide substrate by plasma enhanced chemical vapor deposition and annealing technique.Raman spectra analysis presents that the film has well-proportioned microcrystalline structure and stability.It is proved by mechanics behaviors experiments using scan electronical microscope (SEM) that the film can hold well elastic property under 5mm curvature radius,can support 1mm elastic deformation and its breaking strength is 1.45GPa.The a-Si∶H film on flexible substrate can be used on all kinds of regular and unregular curve faces and support biggish stress.
基金
国家自然科学基金资助项目 (批准号 :5 0 175 0 5 6 )~~
