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用二次离子质谱和扩展电阻探针技术测量硅中注入硼的深度分布及扩展电阻探针技术分辨率的估算 被引量:1

Application of Secondary Ion Mass Spectrometry and Spreading Resistance Probe Technique for Measuring Depth Profile of Boron Implanted in Silicon and Estimation of Resolution of Spreading Resistance Probe Technique
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摘要 利用二次离子质谱和扩展电阻探针技术测量了硅中注入硼的深度分布 .在适当的测量深度 ,用扩展电阻探针技术测得的结果对二次离子质谱技术测量的结果进行了标定 ,从而得到硅片中硼原子的深度分布 .用近似模型估算了扩展电阻探针针尖半径对测试分辨率的影响 .若探针针尖半径为r0 ,测量斜面的角度为 ξ ,在用扩展电阻探针技术测量载流子浓度的深度分布时 ,可以近似认为深度分辨率为 7 86r0 sinξ.还定性讨论了样品表面耗尽层对扩展电阻探针技术的影响 . The dopant profiles in silicon sample implanted by BF 2 are measured using secondary ion mass spectrometry (SIMS) and spreading resistance probe (SRP) techniques.Comparing with the results measured by SIMS and SRP at a suitable depth,the calibration constant of SIMS for boron dopant is got,then the depth profile of boron atoms in silicon are determined.Using a simple model,the work estimated the effect of probe radius on resolution of SRP technique.If the probe radius is r 0,the bevel angle of sample is ξ,then the depth resolution of SRP is about 7.86r 0sinξ.The effect of surface depletion layer of samples on the resolution of SRP is also disscussed.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第3期290-297,共8页 半导体学报(英文版)
关键词 扩展电阻探针技术 深度分布 分辨率 二次离子质谱 硼离子注入 spreading resistance probe resolution secondary ion mass spectrometry boron ion-implantation
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  • 1[1]Pawlik M.Spreading resistance:A quantitative tool for process control and development.J Vac Sci Technol B,1992,10(1):388
  • 2[2]Harrington W L,Magee C W,Pawlik M,et al.Techniques and applications of secondary ion mass spectrometry and spreading resistance profiling to measure ultrashallow junction implants down to 0.5keV B and BF2.J Vac Sci Technol B,1998,16(1):286
  • 3[3]Napolitani E,Carnera A,Priviter V A,et al.Ultrashallow profiling of semiconductors by secondary ion mass spectrometry:methods and applications.Materials Science in Semiconductor Processing,2001,4:55
  • 4[4]Clarysse T,Eyben P,Hantschel T,et al.Towards sub-10nm carrier profiling with spreading resistance techniques.Materials Science in Semiconductor Processing,2001,4:61
  • 5[5]Wolf P De,Clarysse T,Vandervorst W,et al.Low weight spreading resistance profiling of ultrashallow dopant profiles.J Vac Sci Technol B,1998,16(1):401
  • 6[6]Vandervorst W,Clarysse T,Smith H E.Influence of the substrate doping level on spreading resistance profiling.J Vac Sci Technol B,1996,14(1):404
  • 7[7]Clarysse T,Vandervorst W.Qualification of spreading resistance probe operation.J Vac Sci Technol B,1998,16(1):260
  • 8[9]Clarysse T,Vandervorst W.A new spreading resistance correction scheme combining variable radius and barrier resistance with epilayer matching.J Vac Sci Technol B,1992,10(1):432
  • 9[11]Casel A,Jorke H.Comparison of carrier profiles from spreading resistance analysis and from model calculations for abrupt doping structures.Appl Phys Lett,1987,50(15):989
  • 10[12]Clarysse T,Vandervorst W,Casel A,et al.Quantitative analysis of on bevel electrical junction shifts due to carrier spilling effects.Appl Phys Lett,1990,57(26):2856

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