摘要
本文研究了PbO—ZnO—B_2O_3系低熔玻璃和合成β锂霞石填料的复合焊料玻璃制备,以及填料对焊料热膨胀系数(α_C).软化温度(T_f)、封接温度(T_s)和润湿性与流变性能的影响规律;讨论了基质玻璃与填料间复合界面作用;给出了制备热膨胀系数(α_(25～300℃))和T_f分别变化在45～75×10^(-7)/℃和400℃～360℃、兼有较低封接温度和良好润湿性的复合焊料工艺条件和填料的适宜添加量.
In this paper, the manufacture of solder glass composed of PbO-ZnO-B_2O_3low-melting glass and synthesized β-eucryptite filler and the effect of the filler on the thermal expansion coefficient (α_c) of the solder, its softening temperature (T_f), sealing temperature (T_g), wet(?)ing and reologic properties arc studied; the action of the composite interface between the glass matrix and the filler is (?)scussed; and the process parameters as well as the suitable amount of filler to be added for making a composite solder with thermal expansion coefficient(x_(25)-(?)) ranging from 45—75 ×10^(-7) / ℃ and T_f ranging from 400℃— 360℃ and with a low softening temperature and good wetting property are recommended.
出处
《硅酸盐通报》
CAS
CSCD
北大核心
1992年第1期4-9,21,共7页
Bulletin of the Chinese Ceramic Society
基金
浙江省自然科学基金
