在空气中烧结的铜导电浆料

Copper Conductive Paste Sintered in Air

在铜浆中添加还原剂,选用碱性玻璃作无机粘结剂,在有机载体中增加还原成份,使铜浆能在空气中直接烧结。烧结温度740～780℃;导电率2.5～5.0mΩ/□;线分辨率0.2mm;附着力大于1.5kgf/mm^2;可以锡焊及硅铝丝超声焊。铜浆已用于电子元件中部份取代贵金属。

A new copper conductive paste has been manufacturcd through the addition of a reductant in the copper paste and using a basic glass as the adhesive, so that it can be sintered dircetly in the air at 740 to 780℃, The properties of the paste are: conductivity 2.5 to 5.0 mΩ/□; resolution 0.2 mm; adhesive strength over 1.5 kgf/mm^2. It can be welded by tin or ultrasonic welding with Si-Al wire. This paste has been used in clectron elements to partially substitute precious metals.