摘要
为求取芯片内互连线分布电容 ,将其等效为三维拉普拉斯方程的求解 .采用有限差分法解方程 ,并利用截断边界条件截断无穷边界以减小计算量 .实例表明 ,该方法是可行的 。
Parameter extraction for capacitance of on chip interconnects was considered to be equal to solving three dimensional Laplace's equation. Finite difference method was applied and truncated boundary condition was introduced to reduce computation cost. The results show that the method is feasible and efficient.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2003年第3期380-382,共3页
Journal of Shanghai Jiaotong University
关键词
芯片互连线
参数提取
有限差分法
截断边界条件
三维
on chip interconnects
parameter extraction
finite difference method(FDM)
truncated boundary condition
three dimension