一种求芯片内互连线分布电容的方法

Parameter Extraction for Capacitance of On-Chip Interconnects

为求取芯片内互连线分布电容 ,将其等效为三维拉普拉斯方程的求解 .采用有限差分法解方程 ,并利用截断边界条件截断无穷边界以减小计算量 .实例表明 ,该方法是可行的 。

Parameter extraction for capacitance of on chip interconnects was considered to be equal to solving three dimensional Laplace's equation. Finite difference method was applied and truncated boundary condition was introduced to reduce computation cost. The results show that the method is feasible and efficient.