期刊文献+

一种求芯片内互连线分布电容的方法 被引量:2

Parameter Extraction for Capacitance of On-Chip Interconnects
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摘要 为求取芯片内互连线分布电容 ,将其等效为三维拉普拉斯方程的求解 .采用有限差分法解方程 ,并利用截断边界条件截断无穷边界以减小计算量 .实例表明 ,该方法是可行的 。 Parameter extraction for capacitance of on chip interconnects was considered to be equal to solving three dimensional Laplace's equation. Finite difference method was applied and truncated boundary condition was introduced to reduce computation cost. The results show that the method is feasible and efficient.
出处 《上海交通大学学报》 EI CAS CSCD 北大核心 2003年第3期380-382,共3页 Journal of Shanghai Jiaotong University
关键词 芯片互连线 参数提取 有限差分法 截断边界条件 三维 on chip interconnects parameter extraction finite difference method(FDM) truncated boundary condition three dimension
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参考文献3

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同被引文献10

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  • 10王玉洋,刘晨波,李征帆.芯片互连线频变电感和电阻参数提取的程序化[J].上海交通大学学报,2002,36(6):820-823. 被引量:3

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