300mm晶圆对半导体设备的挑战

The Challenge of Semiconductor Equipment from the 300mm Wafer

300mm晶圆生产线必须采用新标准、新技术、新流程、新设备、新布局、新厂房和新设施等。因此,300mm晶圆向半导体设备提出了挑战。

The300mm wafer production line must adopts new standard,new technology,new tach-nological process,new equipment,new layout,new workshop and new installation.The300mm wafer challenges to the semiconductor equipment.