碘化物镀液脉冲电镀Ag-Ni合金工艺

Pulse Plating of Ag-Ni Alloys in Iodide Bath

研究在碘化物体系中 ,采用脉冲电镀Ag Ni合金工艺。研究表明 ,随着 [Ni2 + ]/ [Ag+ ]浓度比增大 ,镀层中镍含量上升 ;镀液温度升高时 ,镀层中镍含量降低 ;增大平均电流密度会提高镀层中镍含量 ,但使镀层表面变差 ;占空比和频率的变化也对镀层成份有一定影响 ;正反向脉冲的个数对镀层成份影响不大 ,但增加反向脉冲的个数 ,会使镀层表面状况好转。经综合分析 ,确定了镍含量为 2 0 %～ 30 %的Ag Ni合金镀层的最佳镀液组成及工艺条件。XRD分析表明 ,镀层结构为简单机械混合物 ,SEM观测表明 ,随镀层中镍含量升高 ,结晶变得粗大。

A pulse plating process of Ag Ni alloys in iodide bath is studied. The results show that the nickel content in the deposit increases with the increase of Ni 2+ /Ag + ratio, but decreases as temperature goes up; the increase of average current density will increase the nickel content in the deposit, but the deposit surface will become poorer; the variations in duty ratio and pulse frequency have a certain influence on the deposit composition; the number of positive and negative pulses has little influence on the deposit composition, but the increase of negative pulses can better the deposit surface condition. Based on a comprehensive analysis, the optimal bath composition and process conditions are decided for a deposit with 20～30% nickel content. XRD analysis indicates that the deposit structure is of a simple mechanical mixture and the SEM observation shows that along with the increase of nickel content, the crystals will become bigger.