摘要
基于AlN陶瓷的导热机理,从显微结构、材料组成、工艺因素三方面来对AlN热导率的影响进行了探讨。AlN高热导率取决于AlN晶间良好接触、第二相含量少呈孤岛状分布以及低气孔率的显微结构,而材料组成、制备工艺的优化是为了具有良好显微结构的AlN陶瓷得以实现和改善。
Based on thermal conduction mechanisms, effects of microstructure, composition and processing
on the thermal conductivity of aluminum nitride ceramics are investigated in this paper. Second phase content and distribution along grain boundaries or at grain junctions may be major factors which influence the thermal conductivity of A1N ceramics. A good microstructure of A1N ceramics is obtained by the optimization of composition and preparation processing.
出处
《材料导报》
EI
CAS
CSCD
2003年第4期28-31,共4页
Materials Reports
基金
国防预研基金(41312011002)