不同磁控溅射模式膜厚均匀性研究

Study on the thickness uniformity of films deposited by magnetron sputtering or unbalanced magnetron sputtering

使用磁控溅射和非平衡磁控溅射方法,在玻璃基底上沉积钛膜.实验了在同等工艺条件下平衡和非平衡两种不同的工作模式对膜厚均匀性的影响.结果表明,靶基距是影响磁控溅射薄膜厚度均匀性的重要工艺参数,在一定范围内,随着靶基距的增大,膜厚分布均匀性有提高的趋势;磁场分布是影响两种磁控溅射膜厚分布差异的主要因素;非平衡磁控溅射膜厚均匀性随附加励磁线圈电流改变而变化.

The titanium (Ti) films were deposited on glass substrates by magnetron sputtering and unbalanced magnetron sputtering respectively. In same sputtering condition, the effect on the thickness uniformity of films prepared by balanced or unbalanced magnetron systems are studied. The results show: the thickness uniformity of films was improved with the increase of distance between target and substrate; the distribution of magnetic field is an important fact that have effect on the uniformity of films thickness; the thickness uniformity of films deposited by unbalanced magnetron systems varies with changes of the current of the additional field coil.