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积层电路板制造用感光绝缘材料的合成研究 被引量:1

Synthesis of Photo Imageable Dielectric Material for BUM Manufacture
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摘要 用丙烯酸改性环氧树脂的方法 ,合成出了环氧丙烯酸酯预聚物 ,并将其用于形成积层电路板永久绝缘内层的UV光固化油墨的新配方中。研究了反应温度 ,催化剂 ,阻聚剂等因素对合成过程和产品的影响。结果表明 ,最佳反应工艺条件是反应温度 90℃ ,催化剂为N ,N 甲基苯胺 ,用量 1 % ,阻聚剂为对苯二酚 ,用量0 .5 %。 In this paper, the epoxy acrylate prepolymer was synthesized by the reaction of epoxy resin E-44 and an acrylic acid. The prepolymer was used to form the hard permanent layer in the fabrication of the build-up multilayer printed circuit board. In the synthesis reaction,the influence factors such as reaction temperature, catalyst, inhibitor and dose were investigated. The result showed that the optimized reaction parameters were temperature 90℃,N,N-methyl toluidine catalyzer 1% and hydrochinone inhibitor 0.5%.
出处 《材料开发与应用》 CAS 2003年第1期30-33,共4页 Development and Application of Materials
关键词 积层电路板 感光绝缘材料 丙烯酸 改性 环氧树脂 印刷电路板 环氧丙烯酸酯预聚物 Epoxy acrylate Photo-imageable dielectric material Build up board UV curing
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