电子束蒸发与磁控溅射镀铝的性能分析研究

Analysis and study on the capability of aluminium films prepared by electron beam vapour deposition and magnetron sputtering

通过对半导体器件电极制备的两种方法即电子束蒸发与磁控溅射镀铝的比较,详细分析了两种方法的膜厚控制、附着力、致密性、电导率和折射率等重要性能指标,测试结果分析表明磁控溅射铝膜的综合性能优于电子束蒸发。

The paper compares two methods of pole preparation in semiconductor productions which are aluminium films prepared by electron beam vapour deposition and magnetron sputter deposition, and analyzes mainly the important capability data such as control of film thickness, adhesion force, conductance and refractive index and so on. The results indicate that the synthesis capability of magnetron sputtered aluminium films is superior to that of electron beam vapour deposition.