摘要
采用老化试验、金相分析、扫描电镜(SEM)及能谱分析(EDX)等手段对引线框架铜合金与SnPb共晶焊料界面组织进行了分析研究.结果表明,引线框架材料对铜合金与SnPb共晶焊料界面组织有很大的影响,焊点在160℃高温老化300 h后,CuCrZr系合金和CuNiSi合金与SnPb的界面金属间化合物为Cu6Sn5,其厚度在5~10 ?m; 而C194合金与SnPb的界面金属间化合物为分布有Pb颗粒的Cu6Sn5,厚度已高达60~70 ?m,同时还发现有微小空洞存在,影响焊点的可靠性.与C194合金相比,CuCrZr系合金和CuNiSi合金具有更好的焊接可靠性.
The Effect of lead frame materials on interface microstructure between copper alloys and SnPb solder was investigated by means of optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy. The result shows that after 300 hours aging at 160℃, the produced interface intermetallic compound (IMC) between CuCrZr alloy, CuNiSi alloy and SnPb solder is Cu6Sn5 of 5~10 mm in thickness. The IMC between C194 alloy and SnPb solder is Cu6Sn5 of 60~70 mm in thickness, with Pb particles and holes, which would be harmful for reliability. As compared with C194 alloy, CuCrZr and CuNiSi alloys exhibit better reliability.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2003年第4期33-35,45,共4页
Electronic Components And Materials
